A revolutionary new dry adhesive technology
Setex® Tape is the world’s first commercial implementation of dry adhesive technology; a solution that is dry, repeatable and residue-free. It is ideal for leading product designers and manufacturing engineers who are frustrated with the limitations of current non-repeatable, tacky and residue-prone alternatives. Currently available as a custom solution, Setex Tape can be manufactured in a wide range of strengths and constructions.
Attributes and Benefits
Repeatability: Setex Tape provides repeatable adhesive performance, unlike PSAs that lose their strength over time.
Dry / Glue-Free / Non-Tacky: Setex Tape is completely dry, providing exceptionally strong adhesion without tack.
Residue-Free: Setex Tape does not leave any sticky adhesive residues when it is removed from a surface.
Customizable Performance: Setex Tape can be designed with varying shear, peel, and tensile adhesive strengths to fit your application’s needs.
How to Apply
Shear Peel Strength
Products | Description | Shear Strength (N/cm²) | 180º Peel Strength (N/cm) | 90º Peel Strength (N/cm) |
|---|---|---|---|---|
DA 910 / DA 110 | High strength dry adhesive microfiber | 30-40 | 1-2 | 0.6-0.8 |
DA 210 | Medium strength dry adhesive microfiber | 20-30 | 0.5 | 0.2-0.4 |
DA 310 | Low strength dry adhesive microfiber | 10 | N/A | N/A |
Performance over 1,000 Peel Cycles
Setex Tape - Plexiglass Peel Demonstration
Setex Tape is seen in this video peeling off a metal surface; the sound you hear is that of thousands of microstructures popping off the metal surface as the tape is pulled back and detached.
Setex Tape Microscopic View
Microscopic video showing the Setex microstructures adhering to surface and detaching as tape is pulled away.
Setex Strength Wafer Demonstration
Setex Tape is seen in this video picking and placing 1mm silicon wafers and delivering them to another carrier surface. This technology enables the picking and placing of the most valuable semiconductor parts for thousands of cycles using vertical displacement only, without leaving a residue.